| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can restrain a film deformation caused by resin pressure and prevents a resin sealing portion from peeling off in a transfer moulding process, and its manufacturing method. SOLUTION: A semiconductor device 1000 has an electrical insulating film 10 having a device hole 12, lead groups 30A to 30D which comprise a plurality of leads 30 located in accordance with a predetermined pattern, being formed in a plurality of lead formation regions from 100 to 400 in a surface of this film 10, an integrated circuit chip 20 in which an inner lead portion 32 of the lead 30 is connected with an electrode 22, being located within the device hole 12 and the resin sealing portion 50 which at least seals the integrated circuit chip 20, the film 10 and the lead groups 30A to 30D. The film 10 is placed in regions from 500 to 800 which are not belonged to the lead formation regions, and includes the first openings 14 which comprise openings from 14a to 14d and the second openings 16 which comprise a plurality of openings from 16a to 16e which are placed within the lead formation regions from 100 to 400. |
