| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of deterioration in humidity resistance being caused by cracks in resin, when a lead frame is cut in a semiconductor device that is demanded to be miniaturized and that uses the lead frame. SOLUTION: A conductive post 10 and a semiconductor pellet 11 are mounted to an insulating base 7 where a conductive land 8 is formed, and the insulating base 7 is covered with a resin 12 so that the conductive post 10 and an electrode on the pellet 11 are exposed. |
