| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve a problem of erroneous detection in comparison inspection due to displacement, caused when selecting comparison inspection areas separat ed from each other within a wafer which expands or shrinks in printing preci sion of individual exposure devices, a thermal treatment process, etc., thereby enabling comparison inspection. SOLUTION: An image above a sample 9 is detected and stored, and displacement between multiple stored sample locations and the corresponding images is statistically calculated to determine expansion/contraction amount 122, rotation 110 and degree of straightness 130. By correcting defective inspection locations based on the printing unit, and the expansion/contraction amount, the rotation and the degree of directness in the printing unit and by controlling a stage and a location of deflecting electron beams, the comparative inspection can be achieved.</p> |
