ELECTRONIC COMPONENT PACKAGING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To obtain enough sealing property from the practical view point for the electrical components which need high air tightness in an electronic component packaging structure for sealing electronic components using a resin bonding materials. SOLUTION: The electronic component packaging structure comprises first and second packaging members to be bonded together to form a containing space S for an electronic component, and a bonding layer 3 for sealing the containing space S by bonding the each bonding faces of both packaging members in a ring state. The bonding layer 3 has a moisture permeability so that the shape of the bonding layer 3 is defined to control moisture permeability through the bonding layer 3 by combining at least the three parameters of the sealing length, bonding thickness and the bonding width of the layer.