| 摘要 |
1282326 Welding by pressure WESTERN ELECTRIC CO Inc 7 Oct 1969 [8 Oct 1968] 49238/69 Heading B3R [Also in Divisions H1 and H2] Each conductor 19 of a vertical array is made able to be bonded by thermocompression to a corresponding conductor 24 in a horizontal array in a single stamping operation along a straight line (33, Fig. 7, not shown) using a thermode or heating arrangement 32 by forming each of the conductors with a parallel offset portion arranged to overlap the offset portion of the corresponding conductor in the other array. The conductors 19 are formed on a relatively low melting point, polyester film 20, each conductor 19 having an offset portion 21 at substantially 45 degrees to the remainder of the conductor. The conductors 24 are formed on a relatively high melting point substrate 25, each having a similar offset portion 26. A mask 29 of relatively high melting point material such as a polymide film and having a rectangular cut-out (30, Fig. 4, not shown) may be introduced between the two arrays to prevent excessive melting of the horizontal conductor substrate 25 and inadvertent contact of adjacent, unconnected conductors. Alternatively, this may be controlled by a choice of conductor and heater geometry. The thermode 32 was operated at 1395‹ F. with an applied pressure of 41,000 lb. per sq. inch with a bonding duration of one second and using a fairly high conductivity base fixture and heat sink clamps to control heat localization. The base fixture was permitted to pivot through an angle of less than 1 degree to improve the bonding pressure distribution.
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