Titanium target assembly for sputtering and method for preparing the same

摘要

A titanium target assembly comprises a sputtering target of titanium, a backing plate composed of copper or a copper alloy and serving as a support member for the target and a coating film composed of silver or a silver alloy and formed between the target and the backing plate, wherein the coating film is formed on the surface subjected to a cleaning treatment on the bonding side of the target or on the bonding sides of the target and the backing plate according to the physical vapor deposition technique and the titanium target and the backing plate are solid phase diffusion bonded, while the face(s) provided with the coating film serves as the bonding plane. The titanium target assembly can be manufactured by a method comprising the steps of cleaning the surface(s) of the target and/or the backing plate on the bonding side(s) thereof, forming a coating film on the cleaned surface(s) on the bonding side(s) and solid phase diffusion-bonding the target and the backing plate at a pressure of not more than 0.1 Pa, a temperature of not less than 400° C. and not more than 450° C. and an applied load during bonding of not less than 40 MPa and not more than 100 MPa for a time of not more than 2 hours, while using the surface(s) provided with the coated film as the bonding plane. The titanium target assembly possesses a high bonding strength and excellent bonding stability and reliability.