发明名称 |
Polyolefin-based composite resin composition having high strength and low linear expansion |
摘要 |
The present invention relates to a polyolefin-based composite resin composition having excellent dimensional stability due to low mold shrinkage, low linear thermal expansion coefficient and low heat sag as well as having excellent mechanical strength, impact resistance, heat resistance, injection molding plasticity and surface smoothness of a product. The composition includes: 30-80% by weight of a crystalline ethylene-propylene copolymer; 5-40% by weight of an ethylene-alpha-olefin copolymer; 5-40% by weight of an inorganic fortifier; and additives.
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申请公布号 |
US2002123572(A1) |
申请公布日期 |
2002.09.05 |
申请号 |
US20010033043 |
申请日期 |
2001.12.26 |
申请人 |
PARK BONG-HYUN;LEE SUNG-JUN |
发明人 |
PARK BONG-HYUN;LEE SUNG-JUN |
分类号 |
C08L23/04;C08L23/08;C08L23/16;(IPC1-7):C08L23/00 |
主分类号 |
C08L23/04 |
代理机构 |
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代理人 |
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地址 |
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