| 摘要 |
According to the present invention, a power conversion device comprises a plurality of sets of power conversion circuits that convert AC to DC or DC to AC by the switching action of a plurality of semiconductor elements, the semiconductor elements that constitute the plurality of sets of power conversion circuits are mounted on a common cooling unit having a heat sink section and heat discharging section. By smoothing out the apportionment of heat loss applied to the plurality of coolers constituting this cooling unit, a cooling construction of the minimum necessary size can be achieved and miniaturization and weight reduction can be realized.
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