| 摘要 |
PURPOSE: A clamp for a semiconductor package is provided to clamp a substrate of various thicknesses on a heater block, by variably and vertically transferring a unit for clamping the substrate. CONSTITUTION: An opening(2) of an almost square type is formed in the center of a plate-type body(1). A plurality of pins are coupled to the body which is an outer circumference of the opening, to vertically transfer the body with respect to the body. A spring is coupled to the pin so that the substrate is closely attached to the heater block by the pin in a wire bonding process. |
