Method preparing for edge-smoothing of semiconductor wafer, locates it on centering plate which is turned, and examines location of measurement point

摘要

The wafer (W) is located on a centering plate (T) in accordance with the desired wafer diameter, using a V-block. Plate and wafer are rotated through a given angle. A sensor determines whether a predefined measurement point lies on the wafer. The point is selected such that it will do so after rotation, if the wafer is of the desired diameter or larger, in which case the wafer is transferred to the material-removing process.