发明名称 Device for handling small components, especially electronic components for test purposes, has a handling mechanism that greatly reduces the contact force when a component is brought together with test contacts
摘要 Device comprises a gripping apparatus (3) for picking up one or more components (1) so that it can be placed in contact with a component contact arrangement (2). Force limiting elements (8, 15) are provided to limit the contact force between component and contact. Elements include a fluid spring arrangement (8) with a pressure controller and sensor (15) for detecting the contact of the component with the contact surface. An Independent claim is made for a method in which the operating behavior of the fluid spring can be controlled using the pressure controller so that contact forces are reduced.
申请公布号 DE10109879(A1) 申请公布日期 2002.09.05
申请号 DE20011009879 申请日期 2001.02.23
申请人 BOS BERLIN OBERSPREE SONDERMASCHINENBAU GMBH 发明人 BISCHOFF, VOLKER;EDLING, KARSTEN;SCHIRDEWAHN, BERNHARD
分类号 G01R31/01;H05K13/04;(IPC1-7):B25J13/08;B25J15/00;B25J19/02;G01R31/26;G01R31/28 主分类号 G01R31/01
代理机构 代理人
主权项
地址