发明名称 |
Device for handling small components, especially electronic components for test purposes, has a handling mechanism that greatly reduces the contact force when a component is brought together with test contacts |
摘要 |
Device comprises a gripping apparatus (3) for picking up one or more components (1) so that it can be placed in contact with a component contact arrangement (2). Force limiting elements (8, 15) are provided to limit the contact force between component and contact. Elements include a fluid spring arrangement (8) with a pressure controller and sensor (15) for detecting the contact of the component with the contact surface. An Independent claim is made for a method in which the operating behavior of the fluid spring can be controlled using the pressure controller so that contact forces are reduced.
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申请公布号 |
DE10109879(A1) |
申请公布日期 |
2002.09.05 |
申请号 |
DE20011009879 |
申请日期 |
2001.02.23 |
申请人 |
BOS BERLIN OBERSPREE SONDERMASCHINENBAU GMBH |
发明人 |
BISCHOFF, VOLKER;EDLING, KARSTEN;SCHIRDEWAHN, BERNHARD |
分类号 |
G01R31/01;H05K13/04;(IPC1-7):B25J13/08;B25J15/00;B25J19/02;G01R31/26;G01R31/28 |
主分类号 |
G01R31/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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