发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PURPOSE: To provide a method for readily using a salicide technology as to a method for manufacturing a semiconductor device for suppressing an increase in wiring resistance of a gate electrode, by replacing the gate electrode with a metallic material. CONSTITUTION: A barrier layer is formed by oxidizing a antireflection film which is stacked before a resist application for preventing a constriction on a transfer pattern formed at the time of optical pattern transfer of a photoresist.
申请公布号 KR20020069502(A) 申请公布日期 2002.09.04
申请号 KR20020010286 申请日期 2002.02.26
申请人 SHARP CORPORATION 发明人 UEDA TAKASHI
分类号 H01L21/28;H01L21/3205;H01L21/336;H01L23/52;H01L29/423;H01L29/43;H01L29/49;H01L29/78;(IPC1-7):H01L29/78 主分类号 H01L21/28
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