HIGH-VOLTAGE, HIGH-CURRENT MULTILAYER CIRCUIT BOARD, METHOD FOR THE PRODUCTION THEREOF

摘要

The invention relates to a high-voltage, high-current multilayer circuit board (36), wherein a plurality of individual circuit boards (25, 26) and first insulating plates (27, 30, 33) are piled on top of each other and firmly connected to each other. At least one metal plate (4, 16) is provided as a conductor inside each individual circuit board (25, 26). High electrical load capacity and stability are achieved by surrounding the entire external edge (5, 17) of at least one metal plate (4, 16) with a positive fitting second insulating plate (1, 13).