| 摘要 |
<p>Device for ball-bonding, has a bonding tool (wedge capillary (12)) through which a bond wire (13), especially aluminium wire, is passed and which is movable up and down at bonding points. A tool (16) forms a ball (17) at the free end of the wire (13) prior to welding same at a bonding point. The ball-forming tool (16) is mechanically coupled to the bonding tool (12) or a bonding head (11) carrying the same, such that it is swing from its ball-forming position during the downstroke of the bonding tool (12) or associated bonding head (11).</p> |
