发明名称 |
MULTILAYERED PRINTED CIRCUIT BOARD |
摘要 |
<p>A multilayer printed wiring board which comprises B layer laminated on one or both faces of A layer, wherein A layer is a layer constituted with one or more layers which comprise a resin composition comprising at least one resin selected from epoxy resins, phenolic resins, unsaturated polyester resins and polyimide resins of a bismaleimide type and B layer is a layer constituted with one or more layers which comprise a resin composition comprising 40% by weight or more of a styrenic resin having a syndiotactic configuration. The printed wiring board exhibits excellent properties at high frequencies and has excellent mechanical strength and impact strength.</p> |
申请公布号 |
EP1237399(A1) |
申请公布日期 |
2002.09.04 |
申请号 |
EP20000979096 |
申请日期 |
2000.12.05 |
申请人 |
IDEMITSU PETROCHEMICAL CO., LTD. |
发明人 |
OTSUKI, YUSUKE;YAMATO, HIROYASU;ISOGAI, OSAMU |
分类号 |
B32B27/30;H05K1/03;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
B32B27/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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