发明名称 Heat treating device and heat treating method
摘要 The heat treatment apparatus has the reaction vessel and the holding tool contained in the reaction vessel for holding a plurality of objects to be processed. The lower end of the reaction vessel is closed by the cover and the insulating unit is installed between the cover and the holding tool. On the top of the insulating unit, the heating unit having a heating resistor composed of a carbon material of high-purity sealed in a quartz plate is installed. Heat insulators are installed under the heating unit. The insulating unit is fixed to the cover, and the revolving shaft for rotating the holding tool passes in the center of the insulating unit, and the electric feeding line member for feeding electric power to the heating unit is arranged outside of the insulating unit.
申请公布号 US6444940(B1) 申请公布日期 2002.09.03
申请号 US20010890328 申请日期 2001.07.30
申请人 TOKYO ELECTRON LIMITED 发明人 SAITO TAKANORI;OSANAI HISAEI;MAKIYA TOSHIYUKI
分类号 H01L21/22;C23C16/455;C23C16/46;H01L21/00;H01L21/205;H01L21/31;(IPC1-7):F27B5/14 主分类号 H01L21/22
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