发明名称 |
Method of achieving solder ball coplanarity on ball grid array integrated circuit package |
摘要 |
A BGA (Ball Grid Array) package fabrication method is proposed for the purpose of achieving solder ball coplanarity on a warped BGA package, such as a concavely-warped BGA package or a convexly-warped BGA package. The proposed method is characterized in the provision of a plurality of variably-sized solder-ball pads over the bottom surface of the substrate, each solder-ball pad having a specified size predetermined in accordance with pre-measured package warpage and predetermined relation of solder ball height against pad size. This provision allows the use of a solder mask having fixed-size openings, as contrary to the prior art that uses a solder mask having variably-sized openings, to allow the implanted solder balls to achieve coplanarity and have strengthened shear for robust solder joint.
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申请公布号 |
US6443351(B1) |
申请公布日期 |
2002.09.03 |
申请号 |
US20000579992 |
申请日期 |
2000.05.26 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
HUANG CHIEN PING;HO TZONG DA |
分类号 |
B23K3/06;H05K1/11;H05K3/34;(IPC1-7):B23K31/02 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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