发明名称 Dicing tape and a method of dicing a semiconductor wafer
摘要 A dicing tape comprising a substrate sheet and a pressure-sensitive adhesive layer formed on one surface of the substrate sheet, wherein the substrate sheet comprises an upper layer in direct contact with the pressure-sensitive adhesive layer, an intermediate layer adjacent to the upper layer, and a lower layer adjacent to the intermediate layer, and an anti-extensibility (A) of the upper layer, an anti-extensibility (B) of the intermediate layer, and an anti-extensibility (C) of the lower layer satisfy the equation (I):the anti-extensibility being a product of a modulus of elasticity and a layer thickness, is disclosed. The present dicing tape can uniformly and sufficiently enlarge dicing lines without affect by a modulus of elasticity of a pressure-sensitive adhesive, and is rarely broken at the dicing lines.
申请公布号 US6444310(B1) 申请公布日期 2002.09.03
申请号 US19990371101 申请日期 1999.08.10
申请人 LINTEC CORPORATION 发明人 SENOO HIDEO;KONDO TAKESHI
分类号 H01L21/301;B28D5/00;C09J7/02;H01L21/68;(IPC1-7):C09J7/02 主分类号 H01L21/301
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