发明名称 |
Three dimensional lead inspection system |
摘要 |
A semiconductor device lead inspection apparatus and method are provided for capturing images of the semiconductor edges and leads along two optical axes which have different directions in a plane perpendicular to the semiconductor device edge. A first image is reflected off an optical surface of a prism to a direction corresponding to the camera optical axis. A second image is reflected by two optical surfaces of the prism to a direction corresponding to the camera optical axis.
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申请公布号 |
US6445518(B1) |
申请公布日期 |
2002.09.03 |
申请号 |
US20000723986 |
申请日期 |
2000.11.28 |
申请人 |
SEMICONDUCTOR TECHNOLOGIES & INSTRUMENTS, INC. |
发明人 |
LEE PAO MENG |
分类号 |
H05K13/04;H05K13/08;(IPC1-7):G02B5/04 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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