Process of packaging a semiconductor device with reinforced film substrate

摘要

Semiconductor devices are manufactured, using film substrates, as follows. Individual film substrates are separated from a film substrate tape having a plurality of film substrates continuously and integrally connected to each other, each the film substrate comprising a base film having first and second surfaces, a circuit pattern being formed on the first surface and a mounting section being formed on the second surface. The base film has an opening to which electrode terminals of a semiconductor element are exposed when the semiconductor element is mounted. The individual film substrates are adhered to respective reinforcement members of a reinforcement frame, which has a plurality of the reinforcement members continuously and integrally connected to each other. Each reinforcement member has an accommodation hole for accommodating the semiconductor element, so that the semiconductor element mount section is exposed in the accommodation hole. A semiconductor element is mounted on the film substrate by adhering an electrode terminal-forming surface of the semiconductor element to said mounting section so that electrode terminals of the semiconductor element are exposed in the accommodation hole. The electrode terminals exposed in the opening are electrically connected to the circuit patterns. The opening is sealed with resin and then the individual reinforcement members are separated from the reinforcement frame.