发明名称 |
Method for forming solder bumps for flip-chip bonding by using perpendicularly laid masking strips |
摘要 |
A method for forming solder bumps for a flip-chip bonding process wherein the bumps have substantially the same height and structures formed by the method are described. In the method, a pre-processed semiconductor substrate that has a plurality of metal traces formed on a top surface is first provided. At least two solder non-wettable masking strips are then deposited on top of and perpendicular to the plurality of metal traces. The at least two solder non-wettable masking strips are deposited spaced-apart at a predetermined spacing sufficient for forming a bond pad therein-between on the plurality of metal traces. Finally, a solder material is deposited onto the bond pads forming solder bumps which are then reflown into solder balls. |
申请公布号 |
US6444561(B1) |
申请公布日期 |
2002.09.03 |
申请号 |
US20000677491 |
申请日期 |
2000.10.02 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
WANG CHIA-CHUNG;CHANG CHUNG-TAO;CHEN KUO-CHUAN |
分类号 |
H01L21/48;H01L21/60;H05K3/34;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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