| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device, which prevents resin from being unfilled in a resin sealing operation due to the large exclusively occupying area of a heat sink, which prevents a drop in the close contact property of the heat sink with the resin, which enhances a heat dissipating property and which increases the number of signal pins by a method, wherein only a required region on a semiconductor-element mounting face on the heat sink at the semiconductor device is resin-sealed. SOLUTION: An electrode 10 at a semiconductor element 8 and an inner lead are connected electrically, via a circuit pattern 13 formed on an insulating tape 7. Thereby, it is not required to extend the inner lead part up to a part near the semiconductor element, and the inner lead can be made short. After that, only a semiconductor- element mounting face is resin-sealed with an epoxy resin or the like by a transfer molding method. Only a required resin on the semiconductor-element mounting face at a semiconductor device, i.e., only a region inside a tie bar in this case, is resin- sealed. That is to say, the rear side of the semiconductor-element mounting face at the semiconductor device is not resin-sealed, and a heat sink 6 which is fixed and bonded to the rear side of the semiconductor-element mounting face is exposed to the outside of a resin-sealed body 11. |
