| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic ink-jet head having a small chip area, and a production method therefor. SOLUTION: Steps until the step of bonding an electrode substrate 11 and a vibrating plate substrate 17 shown in Figs. 1(A)-(C) are same as the conventional steps. In the step of Fig. 1(D), a partition wall 19 is formed by KOH, or the like using a mask with an opening only in the liquid chamber area at the time of etching the liquid chamber area and the pad area. Then, in the step of Fig. 1 (E), the vibrating plate substrate 17 at the pad opening part 20 is eliminated to 10-50μm by dicing. In the step of Fig. 1 (F), the remainder of the vibrating plate substrate 17 and the vibrating plate 18 are eliminated simultaneously by dry etching using a mask with an opening only in the pad opening part. Since the unnecessary inclination part existing in the partition wall 19 of the pad opening part 20 can be eliminated, the chip area can be reduced.
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