Chamber liner for high temperature processing chamber

摘要

An apparatus for fabricating an integrated circuit device comprises an enclosure housing a processing chamber and having a gas inlet for receiving process gases into the processing chamber and a gas outlet for discharging the process gases. A pedestal is disposed within the processing chamber for supporting a wafer thereon. A chamber liner at least partially surrounds the pedestal and includes inner and outer portions. The inner portion comprises a material that is substantially resistant to the process gases at temperatures of at least about 400° C. The outer portion comprises an insulating material for decreasing a thermal gradient between the perimeter of the wafer and the enclosure.