| 摘要 |
A housing for an assembly of electronic components mounted on a circuit board is predominantly made of plastic, and includes a plastic housing cover and a housing floor. Metal surfaces are provided in the housing to preferentially condense moisture from the air in the housing upon cooling, to avoid condensation on the circuit board or the electronic components. The metal surfaces may be a metal casing around an electronic component, a metallized layer deposited on an inner surface of the housing, a metal insert in the housing, a metal housing floor, or an additional metal floor plate adjacent to a plastic housing floor. A hydrophobic film enforces condensate droplet formation, and channels and drain holes drain the condensate droplets out of the housing. An encapsulating film is unnecessary on the electronic components, because condensation on these components is avoided.
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