Electronic component mounted on a flat substrate and padded with a fluid filler

摘要

A method of padding an electronic component, mounted on a flat substrate, with a fluid filler, in which the fluid filler that is applied in a tight-fitting manner to the electronic component mounted n the substrate. The arrangement composed of substrate and electronic component is then heated. The substrate is provided with at least one through orifice in the area of the electronic component prior to applying the filler. The filler is applied at the end of the through orifice facing away from the electronic component.