发明名称 THERMALLY MELT-BONDED MOLDED PRODUCT AND BONDING METHOD THEREFOR
摘要 <p>PROBLEM TO BE SOLVED: To provide a thermally melt-bonding method for thermally bonding a cyclic olefinic resin to a cyclic olefin showing excellent thermal melt adhesiveness with respect to a non-olefinic resin, and to provide a hot-melt bonding method. SOLUTION: A molded product of a copolymer, which consists of 40-95 mol% of a unit originating from a specific cyclic olefin and 50-60 mol% of an ethylene unit, is thermally melt-bonded to a non-olefinic resin molded product.</p>
申请公布号 JP2002248684(A) 申请公布日期 2002.09.03
申请号 JP20010259807 申请日期 2001.08.29
申请人 MITSUBISHI RAYON CO LTD 发明人 MASUDA SEIJI;NAKANISHI HIROSHI
分类号 B29C65/02;B29K23/00;(IPC1-7):B29C65/02 主分类号 B29C65/02
代理机构 代理人
主权项
地址