摘要 |
<p>PROBLEM TO BE SOLVED: To provide a thermally melt-bonding method for thermally bonding a cyclic olefinic resin to a cyclic olefin showing excellent thermal melt adhesiveness with respect to a non-olefinic resin, and to provide a hot-melt bonding method. SOLUTION: A molded product of a copolymer, which consists of 40-95 mol% of a unit originating from a specific cyclic olefin and 50-60 mol% of an ethylene unit, is thermally melt-bonded to a non-olefinic resin molded product.</p> |