发明名称 Method of improving photoresist profile
摘要 A method of improving a photoresist profile. After a photoresist layer is developed, a hard bake is performed at a temperature lower than a glass transition temperature of the photoresist layer. The photoresist layer is thus able to reflow, so that the profile can be modified. Or alternatively, the hard bake step can be replace by first performing a hard bake at a temperature higher than the glass transition temperature, followed by performing a flow bake at a temperature lower than the glass transition temperature.
申请公布号 US6444410(B1) 申请公布日期 2002.09.03
申请号 US20000688606 申请日期 2000.10.14
申请人 UNITED MICROELECTRONICS CORP. 发明人 HUANG I-HSIUNG;CHEN ANSEIME;WANG CHIEH-MING
分类号 G03F7/40;(IPC1-7):G03F7/26 主分类号 G03F7/40
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