发明名称 BOARD-HOLDING COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a board-holding component enabling the transmission of a high-frequency signal between respective boards, without generating noise or reflections, and offering advantageous in terms of manufacturing and in miniaturization of the boards. SOLUTION: When this board-holding component 10 is disposed between respective boards A and B and a component body 20, movable terminals 32 which respectively projects from both sides of the component body 20 are brought into press contact with the respective boards A and B, conductive rubber piece 34 respectively disposed on both sides of the component body 20 is brought into contact with the respective boards A and B, and the via rubber piece 34 is electrically connected with each other via a conductive thin film 20a, so that the respective boards A and B are mutually connected electrically together. At this time, the circumference of each movable terminal 32 is electrically closed, by the thin film 20a covering the circumference of an insulator 33. The formation of the thin film 20a on the component surface obviates the need for using a molded component molded with a die or the like.
申请公布号 JP2002246095(A) 申请公布日期 2002.08.30
申请号 JP20010037391 申请日期 2001.02.14
申请人 IRISO DENSHI KOGYO KK 发明人 SUGAYA YUJIRO;TAKAHASHI NAOMI;KITAYAMA CHIKASHI
分类号 H01R13/24;H01R13/646;H01R13/658;H01R13/6581;H01R13/6595;H01R13/6599;H01R24/40;H01R24/50;H04M1/02;H05K1/14;H05K7/14;H05K9/00 主分类号 H01R13/24
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