| 摘要 |
PROBLEM TO BE SOLVED: To prevent deterioration in the mechanical strength of a semiconductor chip, when manufacturing a rectangular semiconductor chip having different dimensions in height and width. SOLUTION: When the semiconductor chip is to be formed by dividing from a semiconductor wafer, the chip is aligned and arranged so that the shot side of a semiconductor device section is set along a direction which is parallel with the crystal orientation <01-1>, and the chip is formed so that the width of a division region along the short side of the semiconductor device section is narrower than that of a division region, along the long side of the semiconductor device section. |
