WIRING BOARD, TAPE CARRIER AND SEMICONDUCTOR DEVICE USING IT

摘要

PROBLEM TO BE SOLVED: To obtain a wiring board having a structure suitable for mass production in which bumps of flip-chip bonding can be formed at a low cost without requiring wet treatment of a wafer. SOLUTION: In a wiring board for mounting an electronic component where a specified wiring pattern is formed by providing a copper foil 1 on an insulating base material 2, a bump 4 for connection with a semiconductor chip 6 or a printed wiring board is formed at a part of the copper foil pattern, e.g. the forward end of an inner lead, by plating tin or a tin alloy and then the exposed copper surface is coated with a plating film 5 of tin or a tin alloy except the plated part.