COMPOUND LEAD FRAME AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To prevent exfoliation in the case of reflow by improving adherence between a polyimide resin surface of a wiring board rear of a compound lead frame and mold resin. SOLUTION: In the compound lead frame, a wiring board 4 in which a polyimide resin film 7 is made a base material and a wiring pattern 3 is formed on a single surface of the film is bonded to inner leads 2b of a lead frame 1. A polyimide resin surface of the wiring board 4 where the wiring pattern 3 is not present is roughened. The roughness (Ra: center line mean roughness) of the polyimide resin surface is set in a range from 0.2μm to 5μm.