发明名称 HEAT TREATING METHOD AND HEAT TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heat treating method with which the warpage deformation of a body to be treated at elevating of temperature of the body to be treated is prevented, without lowering the throughput. SOLUTION: In this heat treating method, the body W to be treated is mounted on a mounting base 24, installed inside a treatment container 14 capable of being evacuated, the temperature of the body to be treated is elevated to a prescribed temperature, and a prescribed heat treatment is executed. The temperature of the body to be treated is elevated in a state with the body to be treated being provided with temperature distribution in which the temperature of the center part of the body to be treated is high, and the temperature of a peripheral edge part is low. Thus, the warpage deformation of the body to be treated at temperature elevation of the body to be treated is prevented, without lowering the throughput.
申请公布号 JP2002246318(A) 申请公布日期 2002.08.30
申请号 JP20010040570 申请日期 2001.02.16
申请人 TOKYO ELECTRON LTD 发明人 KASAI SHIGERU;MIYASHITA HIROYUKI
分类号 H01L21/302;H01L21/205;H01L21/26;H01L21/3065;(IPC1-7):H01L21/205;H01L21/306 主分类号 H01L21/302
代理机构 代理人
主权项
地址