| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate, in which an end face electrode provided on the outer side face of the substrate can be jointed to the electrode of other substrate through a lead free solder, without causing problems, e.g. conduction faults. SOLUTION: Since the edge part of an end face electrode 16 on the surface side of the substrate is covered with a protective conductor film 15' of a Cu conductor material, a part of the end face electrode 16 covered with a protective conductor film 15' remains together with the protective conductor film 15', even if the edge film is thin when the end face electrode 16 of a substrate 11' is soldered to the electrode 18 of other substrate 17 through a lead free solder 20, because the protective conductor film 15' is composed of a Cu conductor material which is not diffused easily into the lead-free solder 20. Consequently, the edge part of the end face electrode 16 on the surface side of the substrate is prevented from being cut subjected to edge cutting.
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