| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer dividing method for exactly dividing a semiconductor wafer at desired positions. SOLUTION: Notching 12 is made at a desired position on the end face of the semiconductor wafer 10. Then, on the back of the semiconductor wafer 10, a rod-like member 20 is arranged nearly in parallel in the direction where the notching 12 has been made. After that, a load substantially equal is applied to both the sides of the rod-like member 20 from the front to back sides of the semiconductor wafer 10, thus dividing the semiconductor wafer 10.
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