发明名称 WAFER ALIGNMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an alignment device which can read a character or a code made on a wafer by using a line sensor used in the alignment device. SOLUTION: An edge WE of the wafer W, supported by a rotary shaft, is irradiated with light from a detection means 10A, and the position of a notch (or orientation flat) N and the position of the identification code M are measured. The detection means 10A has an irradiation part 20A, having a semiconductor laser 21A as a light source, a rod lens 22A and a spherical lens 23A, an imaging part 25A having a half mirror 26A, a telecentric lens 27A and an opening diaphragm 28A, a line sensor 32A, which is arranged below the wafer W and detects the notch N and the line sensor 31A which, is arranged at the exit side of the opening diaphragm 28A and detects the position of the identification code M the image of which is formed.
申请公布号 JP2002246446(A) 申请公布日期 2002.08.30
申请号 JP20010043559 申请日期 2001.02.20
申请人 ASSIST JAPAN KK 发明人 MORISONO MASAAKI;MITSUISHI SETSUYA;UCHIDA MASAYOSHI;KATSURA HIROSHI;YOSHIDA JUN;MIZUNO SEINOSUKE
分类号 G02B19/00;G03F7/20;G06K9/20;G06T1/00;H01L21/68 主分类号 G02B19/00
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