METHOD OF MANUFACTURING CERAMIC TERMINAL

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic terminal which can adhere a metallized layer of sufficient thickness even on edges in forming the metallized layer on the upper face and the side faces of the ceramic terminal used for a metal-wall semiconductor package. SOLUTION: This manufacturing method is for a ceramic terminal that electrically connects inside and outside of a metal frame that accommodates a semiconductor element while the terminal is insulated from the metal frame. Through holes 34 are formed in a green sheet 90. A band-shaped metallized layer 42 are formed on the upper face of the green sheet 90 which contains the through holes 34, and the metallized layer 44 is formed inside the through hole 34. By firing the green sheet 90, a ceramic terminal is obtained where the metallized layer is formed on the upper face and side faces.