| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of a metallization layer meting down, when a high current flows therethrough. SOLUTION: The ceramic circuit board comprises a plurality of metallization layers 2, formed on a ceramic substrate 1 where a metal circuit board 3 of aluminum is fixed to a part of the metallization layer 2 and the relation S>=9×10-5i2 is satisfied between the cross-sectional area S (mm2) of the metal circuit board 3 and a flowing current i (A). |
