| 摘要 |
PROBLEM TO BE SOLVED: To reduce weight and improve heat dissipation in a package for a semiconductor integrated circuit, wherein a semiconductor integrated circuit is fixed in a base member whose upper part is opened and a metal lid plate, put on an opening of a base member, is subjected to seam jointing to a base member and is sealed airtightly. SOLUTION: A base member has an aluminum part, whose upper part is opened and a metal sealing frame of high electric resistance which is jointed to an opening edge of the body part. A metal lid plate is subjected to seam jointing to a seal frame. A seal frame having high electric resistance is covar, and a covar lid plate way also be used. It is preferable to apply gold plating or nickel plating to the covar. A metal seal frame is jointed by a discharge plasma sintering method, and a metal lid plate is subjected to seam jointing to a seal frame. |
