| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging method which is capable of reducing a thin film passive part in a cycle time and production cost by bonding the thin film passive part which is formed into a silicon chip to a ceramic or glass board to make it improved in stress resistance and by packaging it through a thick film packaging method. SOLUTION: This packaging method comprises a first step of providing a silicon chip board, second step of forming a part on the board, third step of forming a passivation layer through a screen printing method and forming a plurality of dice through marking, back lapping, and dicing, fourth step of dicing a ceramic or glass board used for this part twice into a board of proper shape, fifth step of applying an adhesive agent on the surface of the above board, sixth step of bonding the rear of the die to the surface of the board where the adhesive agent has been applied, and seventh step of carrying out a thick film packaging process.
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