| 摘要 |
PROBLEM TO BE SOLVED: To provide a method capable of mounting a flip-chip on a pattern having a wiring pitch of 70 μm or less even by a bonding bump using a general gold wire having a diameter of 25 μm. SOLUTION: The method for mounting the flip-chip comprises the steps of forming a gold bump sharpened at its distal end on an aluminum electrode of a semiconductor chip, by tearing off the distal end through gold wire bonding, forming to array wirings drawn to the outermost row for all a plurality of zigzag rows of semiconductor chip electrodes on a substrate pattern, gold plating the surface, position-regulating the pattern, and the gold bumps on the chip electrodes, controlling a collapsing load and a temperature of the gold bump by pressure welding through heating, pressurizing and ultrasonic wave, and connecting the gold bump distal end to the pattern in the same width as that of the pattern or at a narrower part. |
