| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip resistor which can be stably mounted on the surface of a board when the chip resistor is mounted on solder bumps formed on the electrodes of the surface of the board by making its surface face down. SOLUTION: Solder bumps are formed on electrodes 21 on the surface of a board, and a chip resistor is mounted on the board by making its surface face downward. Notches 21a and 21b are provided to the electrode 21, and hemispherical projections 23a, 23b and 24c are provided to the solder bump formed on the electrode 21.</p> |
