| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem of corrosion causing discoloration, burnout, or the like which occur at an external lead terminal since the exposed surface of the external lead terminal cannot be completely covered with metal, such as Ni and Au. SOLUTION: This package for accommodating semiconductor devices has nearly a square insulating substrate 1 that has a placement section 1a for placing a semiconductor device 2 on the upper surface, the pluralities of external lead terminals 5 jointed to a side section on the upper surface or lower surface of the insulating substrate 1, while one end projects outside the insulating substrate 1, and an electrically insulating connection member 6 that has pluralities of metal layers 6a where each outside end section of the pluralities of external lead terminals 5 at each side section is brazed for fixing. In the external lead terminal 5, a projection 5a having nearly a square-shaped section is formed on a surface opposite to the metal layer 6a of the connection member 6. In this case, when the maximum width of a top surface at the projection 5a is set to T1 and the width of the metal layer 6a is set to T2, T1<=T2.</p> |
