HEAT TREATMENT DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a heat treatment device, with which the operating characteristics and reliability of a semiconductor device are improved and manufacturing cost is reduced. SOLUTION: This heat treatment device is provided with a reaction pipe, a pressurizing means for turning the inside of the reaction pipe into high pressure and a light source for heating the body to be treated installed inside the reaction pipe. In the manufacturing method of the semiconductor device using such a constitution, the inside of the reaction pipe is held at a high pressure and the body to be treated placed inside the reaction pipe is heated by light emitted from the light source provided on the outer side of the reaction pipe.