| 摘要 |
PROBLEM TO BE SOLVED: To make reflectance loss at the time of inputting/outputting a high frequency signal to be very small. SOLUTION: A package is provided with a substrate 1 having an installation part 1a where a semiconductor element 7 and a circuit board 9 are installed on an upper face through an installation base 8, a frame body 2 which is fitted to the upper face of the substrate 1 so that it surrounds the installation part 1a and in which a through hole 2a is formed on a side part and a coaxial connector 3 which is constituted of a cylindrical outer peripheral conductor 3a, a center conductor 3c arranged in the center axis and an insulator 3b laid between them, is engaged with the through hole 2a and is electrically connected to the circuit board 9. In the coaxial connector 3, the center conductor 3c protrudes from the insulator 3b and the thickness of a part from the inner face of the frame body 2 of the center conductor 3c to a tip part connected to the circuit board 9 is set to be 10 to 50% of the remaining part. |
