| 摘要 |
PROBLEM TO BE SOLVED: To simplify material and manufacturing processes by using a surface protective resin also as an adhesive, and increase adhesiveness of the semiconductor chip. SOLUTION: The BGA type semiconductor device has a stacked structure made up of two laminated semiconductor chips 4 and 5. When the semiconductor chip 5 is laminated on the semiconductor chip 4, an adhesive in a paste-like state is applied on the surface of the semiconductor chip 4 having no surface protective resin and the like applied thereon. The adhesive 6 functions as an adhesive and also as pellet surface protection. In this case, the adhesive 6 is made of polyimide-, epoxy-, acryl- or their mixture-based material of either thermoplastic or heat hardening type. As a result, the resin material is saved and the manufacturing process can be simplified.
|
