| 摘要 |
PROBLEM TO BE SOLVED: To easily and simultaneously form highly precise circuit electrode patterns having clear-cut line-edges as compared to conventional ones and terminal electrodes having a thickness of a certain amount. SOLUTION: Predetermined circuit electrode patterns 13A, 13B, semiconductor chips 11A, 11B mounted on the circuit electrode patterns 13A, 13B, terminal electrodes 15A, 15B connected to the semiconductor chips 11A, 11B, and a sealing material 12 that seals and insulates by covering all of the circuit electrode patterns 13A, 13B the semiconductor chips 11A, 11B, and a part of the terminal electrodes 15A, 15B, are provided. The circuit electrode patterns 13A, 13B are formed by plating a desired electrically conductive material on a face of a copper-alloy plate which is susceptible to plating and etching while the terminal electrodes 15A, 15B are formed by plating a desired electrically conductive material on both faces of the copper-alloy plate, and thereafter the formation is finished simultaneously by selectively removing the copper-alloy plate by etching. Since no organic substrate such as a prepreg is used, it is possible to manufacture thin semiconductor-chip-mounted substrates.
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