| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a flexible printed circuit board with entire thickness being smaller, and to provide a method for manufacturing the flexible printed circuit board. SOLUTION: This flexible printed circuit board has a component-packaging section for mounting electronic components, and a cable section that is placed adjacent to the component-packaging section; a circuit pattern formed at a cable section is covered with a flexible lamination adhesive 3; the flexible printed circuit board has a component-mounting section, that is composed by overlapping an outer layer material 4 onto the inner layer material 1 via insulation covering 3; and the cable section, that is composed by providing insulation covering 3 to the inner layer material 1 and, is placed adjacent to the component-packaging section. In the manufacturing method of the flexible printed circuit board, the inner layer material at the component packaging and cable sections are covered by the flexible lamination adhesive 3 for treatment.</p> |
