| 摘要 |
PROBLEM TO BE SOLVED: To provide a hot plate unit that can quickly dry up a material containing the solvent of photosensitive resin, etc., applied to the surface of a semiconductor wafer. SOLUTION: This hot plate unit is provided with a ceramic substrate, on or in which a resistive heating element composed of a plurality of circuits is formed, a support container which supports the ceramic substrate, and a temperature-measuring element. The unit is also provided with a control section, a storing section, and an arithmetic section. In addition, the unit is provided with a blowing means, which supplies a gas that is made to pass the vicinity of the heating surface of the ceramic substrate. In addition, the unit is constituted to supply different kinds of electric power to the circuits of the resistive heating element, so as to adjust the temperature of the heating surface.
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