METHOD OF MANUFACTURING ELECTRONIC COMPONENT AND ALIGNER FOR USED IN THIS

摘要

PROBLEM TO BE SOLVED: To provide an aligner for solving the problem that the accuracy of a transfer of a circuit patter is enhanced in a method of dipping a material to be treated into a developing solution like conventional methods, but the developing solution is needed in large quantities and the method lacks in the mass productivity of the material to be treated. SOLUTION: An aligner is constituted in such a structure that a developing solution is fed to the main surface on one side of the main surfaces of a material to be treated to turn the material to be treated paddled and the material to be treated is intermittingly rotated as the material to be treated keeps paddled.